Lead-Free Defense Electronics Project

This project will foster research and actions to accelerate the transition to lead-free electronics in aerospace, defense, and other high-performance electronics.

Lead-free electronics – materials and processes with profound consequences

Materials applied at the microscopic level on commonly used subcomponents critical to the functions of sophisticated defense systems in diverse, challenging environments throughout – and beyond – the planet.

The DEC lead-free team has the deep industry knowledge, innovative research capabilities, and leading-edge facilities required to successfully migrate to lead-free defense electronics.

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years experience transitioning lead-free solders from lab to product.
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lead-free alloys from consortia and projects for gap analysis.
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Research University Labs fully provisioned with equipment and materials required for microelectronics research.
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Advanced Testing Facilities capable of simulating extreme temperature high impact use scenarios.
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Industry-Leading System Integrators individually and through PERM, including BAE, Boeing, Collins Aerospace, Honeywell, L3Harris, Lockheed Martin, Northrup Grumman, Raytheon, and Draper

The project team is led by Purdue University, the University of Maryland and Auburn University. The team has access to IPC’s 3,000 members for insight into industry standards and channels for information exchange and tech transfer.